process | ability and accuracy | |
photoresist coating | spin coating | glue thickness accuracy≤3% (applicable to plane) |
| photoresist coating | spin coating | glue thickness accuracy ≤10% (suitable for flat/concave surface) |
photolithography | accuracy 2um registration accuracy: 0.15um | |
development | accuracy 2um development uniformity <5% | |
etching | size dispersion ±1um | |