| parameter | tgv standard specification |
| material | glass, fused silica etc. |
| wafer size | 4”, 6”, 8”, 12” etc. |
| mini. thk. | 0.2mm(< 6”), 0.3mm(8”), 0.35mm(12”) |
| mini. dia. via | 20μm |
| taper | 3~8° |
| pitch | 50μm, 100μm, 150μm etc. |
| max. aspect ratio | 1:10 |
| metallization | ar film, reflection film, splitter film etc. |
* remark：customized is available | |